Invention Grant
- Patent Title: Processing apparatus and processing method, and gas cluster generating apparatus and gas cluster generating method
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Application No.: US17883997Application Date: 2022-08-09
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Publication No.: US11772138B2Publication Date: 2023-10-03
- Inventor: Kazuya Dobashi , Chishio Koshimizu
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JP 15068867 2015.03.30 JP 15181637 2015.09.15
- The original application number of the division: US15715482 2017.09.26
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B7/00 ; B08B5/00 ; H01J37/32 ; H01L21/311 ; H01L21/67

Abstract:
A processing method includes: disposing a workpiece in a processing container of a processing apparatus, and maintaining an inside of the processing container in a vacuum state; providing a cluster nozzle in the processing container; supplying a cluster generating gas to the cluster nozzle and adiabatically expanding the cluster generating gas in the cluster nozzle, thereby generating gas clusters; generating plasma in the cluster nozzle to ionize the gas clusters and injecting the ionized gas clusters onto the workpiece; supplying a reactive gas to the cluster nozzle and exposing the reactive gas to the plasma such that the reactive gas becomes monomer ions or radicals; and supplying the monomer ions or radicals to the processing container, thereby exerting a chemical reaction on a substance present on a surface of the workpiece.
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Information query
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