Invention Grant
- Patent Title: Transistors including first and second semiconductor materials between source and drain regions and methods of manufacturing the same
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Application No.: US16650307Application Date: 2018-01-12
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Publication No.: US11777022B2Publication Date: 2023-10-03
- Inventor: Sansaptak Dasgupta , Marko Radosavljevic , Han Wui Then
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- International Application: PCT/US2018/013602 2018.01.12
- International Announcement: WO2019/139621A 2019.07.18
- Date entered country: 2020-03-24
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/20 ; H01L29/24 ; H01L29/267 ; H01L29/40 ; H01L29/66

Abstract:
Methods, apparatus, systems and articles of manufacture are disclosed for transistors including first and second semiconductor materials between source and drain regions. An example apparatus includes a first semiconductor material and a second semiconductor material adjacent the first semiconductor material. The example apparatus further includes a source proximate the first semiconductor material and spaced apart from the second semiconductor material. The example apparatus also includes a drain proximate the second semiconductor material and spaced apart from the first semiconductor material. The example apparatus includes a gate located between the source and the drain.
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