Invention Grant
- Patent Title: Electrical conveyance assembly
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Application No.: US16887252Application Date: 2020-05-29
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Publication No.: US11785736B2Publication Date: 2023-10-10
- Inventor: Christopher T. Cantrell
- Applicant: Eaton Intelligent Power Limited
- Applicant Address: IE Dublin
- Assignee: Eaton Intelligent Power Limited
- Current Assignee: Eaton Intelligent Power Limited
- Current Assignee Address: IE Dublin
- Agency: Merchant and Gould PC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; G06K19/07 ; H01L23/36 ; B64D15/12 ; B29C64/00 ; B33Y80/00
Abstract:
An electrical conveyance assembly includes a substrate that may include an electrically insulating material. The electrical conveyance assembly may include a plurality of electrical conductors connected to the substrate via additive manufacturing. The substrate may include an internal lattice structure formed via additive manufacturing. The substrate may include an internal fluid channel.
Public/Granted literature
- US20200383231A1 ELECTRICAL CONVEYANCE ASSEMBLY Public/Granted day:2020-12-03
Information query
