Invention Grant
- Patent Title: Conductive wire structure
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Application No.: US17707968Application Date: 2022-03-30
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Publication No.: US11804381B2Publication Date: 2023-10-31
- Inventor: Huang-Nan Chen
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- The original application number of the division: US16903382 2020.06.17
- Main IPC: H01L21/3213
- IPC: H01L21/3213 ; H01L23/528 ; H01L21/033 ; H01L21/768 ; H01L23/522
Abstract:
A conductive wire structure including a first conductive wire and a second conductive wire is provided. The second conductive wire is located on one side of the first conductive wire. The first conductive wire includes a first conductive wire portion and a first pad portion. The first conductive wire portion extends in a first direction and has a first end and a second end. The first pad portion is connected to the first end of the first conductive wire portion. The second conductive wire includes a second conductive wire portion and a second pad portion. The second conductive wire portion extends in a second direction and has a third end and a fourth end. The third end is adjacent to the first end, and the fourth end is adjacent to the second end. The second pad portion is connected to the fourth end of the second conductive wire portion.
Public/Granted literature
- US20220223432A1 CONDUCTIVE WIRE STRUCTURE Public/Granted day:2022-07-14
Information query
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