Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US17034181Application Date: 2020-09-28
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Publication No.: US11804518B2Publication Date: 2023-10-31
- Inventor: Jungmin Park , Haeryong Kim , Young-geun Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20190174171 2019.12.24
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H10B12/00 ; H01L21/02 ; H01L49/02 ; C23C16/40

Abstract:
A semiconductor device includes a capacitor including a lower electrode an upper electrode, and a dielectric layer between the lower electrode and the upper electrode. The lower electrode includes ABO3 where ‘A’ is a first metal element and ‘B’ is a second metal element having a work function greater than that of the first metal element. The dielectric layer includes CDO3 where ‘C’ is a third metal element and ‘D’ is a fourth metal element. The lower electrode includes a first layer and a second layer which are alternately and repeatedly stacked. The first layer includes the first metal element and oxygen. The second layer includes the second metal element and oxygen. The dielectric layer is in contact with the lower electrode at a first contact surface the first contact surface corresponding to the second layer.
Public/Granted literature
- US20210193457A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-06-24
Information query
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