A bridge PCB is disclosed, which comprises: a substrate, a first HF connector, a second HF connector, a first antenna connector, and a first electrical connector, of which a millimeter-wave antenna module is connected with the first antenna connector that is disposed at outside of an electronic device. On the other hand, the first HF connector is coupled to a main board in the electronic device through a first signal transmission cable, and the second HF connector is coupled to the main board through a second signal transmission cable. By such arrangements, the millimeter-wave antenna module is not influenced by the case of an electronic device during the transceiving of millimeter-wave signal. Therefore, there is no need to use a particularly-designed flexible PCB to bridge the mobile communication signal processor and the millimeter-wave antenna module.