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公开(公告)号:US11804647B2
公开(公告)日:2023-10-31
申请号:US17842485
申请日:2022-06-16
Applicant: LANNER ELECTRONICS INC.
Inventor: Rui-Xuan Lee , Yun-Hung Chen
CPC classification number: H01Q1/2283 , H01L23/481 , H01L23/66 , H01Q1/243 , H01Q23/00 , H01L2223/6677
Abstract: A bridge PCB is disclosed, which comprises: a substrate, a first HF connector, a second HF connector, a first antenna connector, and a first electrical connector, of which a millimeter-wave antenna module is connected with the first antenna connector that is disposed at outside of an electronic device. On the other hand, the first HF connector is coupled to a main board in the electronic device through a first signal transmission cable, and the second HF connector is coupled to the main board through a second signal transmission cable. By such arrangements, the millimeter-wave antenna module is not influenced by the case of an electronic device during the transceiving of millimeter-wave signal. Therefore, there is no need to use a particularly-designed flexible PCB to bridge the mobile communication signal processor and the millimeter-wave antenna module.
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公开(公告)号:US20230187812A1
公开(公告)日:2023-06-15
申请号:US17842485
申请日:2022-06-16
Applicant: LANNER ELECTRONICS INC.
Inventor: Rui-Xuan Lee , Yun-Hung Chen
CPC classification number: H01Q1/2283 , H01Q1/243 , H01Q23/00 , H01L23/481 , H01L23/66 , H01L2223/6677
Abstract: A bridge PCB is disclosed, which comprises: a substrate, a first HF connector, a second HF connector, a first antenna connector, and a first electrical connector, of which a millimeter-wave antenna module is connected with the first antenna connector that is disposed at outside of an electronic device. On the other hand, the first HF connector is coupled to a main board in the electronic device through a first signal transmission cable, and the second HF connector is coupled to the main board through a second signal transmission cable. By such arrangements, the millimeter-wave antenna module is not influenced by the case of an electronic device during the transceiving of millimeter-wave signal. Therefore, there is no need to use a particularly-designed flexible PCB to bridge the mobile communication signal processor and the millimeter-wave antenna module.
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