Invention Grant
- Patent Title: Profiling apparatus
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Application No.: US16968497Application Date: 2019-01-18
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Publication No.: US11806867B2Publication Date: 2023-11-07
- Inventor: Shinichi Iida , Shigeaki Tochimoto , Hiroshi Takaoka
- Applicant: KONICA MINOLTA, INC.
- Applicant Address: JP Chiyoda-ku
- Assignee: KONICA MINOLTA, INC.
- Current Assignee: KONICA MINOLTA, INC.
- Current Assignee Address: JP Tokyo
- Agency: Cozen O'Connor
- Priority: JP 18021585 2018.02.09
- International Application: PCT/JP2019/001368 2019.01.18
- International Announcement: WO2019/155845A 2019.08.15
- Date entered country: 2020-08-07
- Main IPC: G01B5/20
- IPC: G01B5/20 ; B25J19/02 ; B25J9/16

Abstract:
A profiling apparatus includes: a holder rotationally moves around a first fulcrum, and holds a subject; a balancer rotationally moves around a second fulcrum, an intermediate part coupled to holder part and balancer, expands and contracts in a coupling direction, and bends in a direction orthogonal to the coupling direction, in which a position of the first fulcrum, a first gravity center position, a bending position, and a second gravity center position are aligned in this order. The first gravity center position corresponds to a gravity center of a part, which rotationally moves around the first fulcrum, of the subject and the holder in a case where the subject is held. The bending position corresponds to a bending point of the intermediate part. The second gravity center position corresponds to a gravity center of a part, which rotationally moves around the second fulcrum, of the second fulcrum position and balancer.
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