Invention Grant
- Patent Title: Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
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Application No.: US17114466Application Date: 2020-12-07
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Publication No.: US11822099B2Publication Date: 2023-11-21
- Inventor: Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
- Applicant: NINGBO SUNNY OPOTECH CO., LTD.
- Applicant Address: CN Zhejiang
- Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee Address: CN Zhejiang
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: CN 1610143457.7 2016.03.12 CN 1620191631.0 2016.03.12 CN 1610149444.0 2016.03.15 CN 1620201261.4 2016.03.15 CN 1610214411.X 2016.04.07 CN 1610669214.7 2016.08.12 CN 1620875781.3 2016.08.12 CN 1620876056.8 2016.08.12 WO TCN2016103736 2016.10.28
- The original application number of the division: US15317117
- Main IPC: H01L31/16
- IPC: H01L31/16 ; G02B3/00 ; H05K3/28 ; H01L25/00 ; H04N23/45 ; H04N23/51 ; H04N23/55 ; G02B7/00
Abstract:
An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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