Invention Grant
- Patent Title: Method of preparing an electrode for use in forming a honeycomb extrusion die
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Application No.: US17613822Application Date: 2020-05-21
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Publication No.: US11833604B2Publication Date: 2023-12-05
- Inventor: Timothy Eugene Antesberger , Dana Craig Bookbinder , Dana Eugene Coots , Seyed Amir Farzadfar , Dominick John Forenz , Ryan Joseph Grohsmeyer , Mark Lee Humphrey , Zakariya Radwan Khayat , Kenneth Richard Miller , Richard Curwood Peterson , John Charles Rector
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Joseph M. Homa
- International Application: PCT/US2020/033934 2020.05.21
- International Announcement: WO2020/237012A 2020.11.26
- Date entered country: 2021-11-23
- Main IPC: B23H7/24
- IPC: B23H7/24 ; B33Y10/00 ; B22F10/28 ; B22F10/36 ; B22F10/38 ; B33Y80/00 ; B29C48/30 ; B29C48/32 ; B33Y40/20 ; B28B3/26 ; B22F10/66 ; B22F10/62 ; B22F10/25

Abstract:
Methods for forming an electrode for use in forming a honeycomb extrusion die. The method includes forming, by means of an additive manufacturing process, an electrode includes a base having a web extending from the base. The web defines a matrix of cellular openings. The method further includes forming a secondary electrode having a plurality of pins. The plurality of pins are shaped and arranged so as to mate with the matrix of cellular openings defined by the web of the electrode. The method further includes machining the electrode using the secondary electrode to smooth surfaces of the electrode formed by the additive manufacturing process.
Public/Granted literature
- US20220234108A1 METHOD OF PREPARING AN ELECTRODE FOR USE IN FORMING A HONEYCOMB EXTRUSION DIE Public/Granted day:2022-07-28
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