Invention Grant
- Patent Title: High electron mobility transistor (HEMT)
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Application No.: US17145414Application Date: 2021-01-11
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Publication No.: US11843046B2Publication Date: 2023-12-12
- Inventor: Huai-Tzu Chiang , Sheng-Hao Lin , Kuan-Hung Liu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 1910639471.X 2019.07.16
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/423 ; H01L29/45 ; H01L29/66 ; H01L29/08

Abstract:
A high electron mobility transistor (HEMT) includes a buffer layer, a carrier transit layer, a carrier supply layer, a gate, a source electrode and a drain electrode. The buffer layer is on a substrate. The carrier transit layer is on the buffer layer. The carrier supply layer is on the carrier transit layer. The gate is on the carrier supply layer. The source electrode and the drain electrode are at two opposite sides of the gate, wherein each of the source electrode and the drain electrode includes a conductive layer and a conductive oxide layer stacked from bottom to top.
Public/Granted literature
- US20210134994A1 HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) Public/Granted day:2021-05-06
Information query
IPC分类: