Invention Grant
- Patent Title: Object management in tiered memory systems
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Application No.: US17322235Application Date: 2021-05-17
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Publication No.: US11861222B2Publication Date: 2024-01-02
- Inventor: Reshmi Basu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G06F12/0882

Abstract:
Systems, apparatuses, and methods related to object management in tiered memory systems are discussed. An example method can include writing a memory object to a first memory device of a first type of memory medium. The example method can include determining that a size of the memory object meets or exceeds a threshold data size. The example method can include writing the memory object to a second memory device that comprises a second type of memory medium different than the first type. The first memory medium can be a non-volatile memory comprising phase-change memory or resistive random access memory (RAM) and the second memory medium can be NAND Flash or NOR Flash.
Public/Granted literature
- US20220365720A1 OBJECT MANAGEMENT IN TIERED MEMORY SYSTEMS Public/Granted day:2022-11-17
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