Invention Grant
- Patent Title: Neighboring gate-all-around integrated circuit structures having disjoined epitaxial source or drain regions
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Application No.: US17846439Application Date: 2022-06-22
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Publication No.: US11862635B2Publication Date: 2024-01-02
- Inventor: Leonard P. Guler , Biswajeet Guha , Tahir Ghani , Swaminathan Sivakumar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- The original application number of the division: US16134719 2018.09.18
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/06 ; H01L29/08 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
Neighboring gate-all-around integrated circuit structures having disjoined epitaxial source or drain regions, and methods of fabricating neighboring gate-all-around integrated circuit structures having disjoined epitaxial source or drain regions, are described. For example, a structure includes first and second vertical arrangements of nanowires, the nanowires of the second vertical arrangement of nanowires having a horizontal width greater than a horizontal width of the nanowires of the first vertical arrangement of nanowires. First and second gate stacks are over the first and second vertical arrangements of nanowires, respectively. First epitaxial source or drain structures are at ends of the first vertical arrangement of nanowires, and second epitaxial source or drain structures are at ends of the second vertical arrangement of nanowires. An intervening dielectric structure is between neighboring ones of the first epitaxial source or drain structures and of the second epitaxial source or drain structures.
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