Invention Grant
- Patent Title: Substrate cleaning method, processing container cleaning method, and substrate processing device
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Application No.: US18048102Application Date: 2022-10-20
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Publication No.: US11865590B2Publication Date: 2024-01-09
- Inventor: Kyoko Ikeda , Kazuya Dobashi , Tsunenaga Nakashima , Kenji Sekiguchi , Shuuichi Nishikido , Masato Nakajo , Takahiro Yasutake
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP 18225669 2018.11.30
- The original application number of the division: US17295971
- Main IPC: B08B5/02
- IPC: B08B5/02 ; H01L21/02
Abstract:
A substrate cleaning method includes: arranging a substrate within a processing container; spraying gas from a spray port of a gas nozzle arranged within the processing container; causing vertical shock waves, generated by spraying the gas from the gas nozzle, to collide with a main surface of the substrate; and removing particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.
Public/Granted literature
- US20230063907A1 SUBSTRATE CLEANING METHOD, PROCESSING CONTAINER CLEANING METHOD, AND SUBSTRATE PROCESSING DEVICE Public/Granted day:2023-03-02
Information query
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