Invention Grant
- Patent Title: Asymmetry correction via oriented wafer loading
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Application No.: US17696813Application Date: 2022-03-16
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Publication No.: US11869815B2Publication Date: 2024-01-09
- Inventor: Eric Lau , Charles C. Garretson , Huanbo Zhang , Zhize Zhu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- The original application number of the division: US16552456 2019.08.27
- Main IPC: H01L21/66
- IPC: H01L21/66 ; B25J9/16 ; H01L21/306 ; H01L21/67 ; H01L21/687 ; B24B37/30 ; B24B49/12
Abstract:
A method for chemical mechanical polishing includes receiving an angular removal profile for a carrier head and an angular thickness profile of a substrate. Prior to polishing the substrate, a desired angle of the carrier head relative to the substrate is selected for loading the substrate into the carrier head. Selecting the desired angle is performed based on a comparison of the angular removal profile for the carrier head and the angular thickness profile of the substrate to reduce angular non-uniformity in polishing. The carrier head is rotated to receive the substrate at the desired angle, the substrate is transferred to the carrier head and loaded in the carrier head with the carrier head at the desired angle relative to the substrate, and the substrate is polished.
Public/Granted literature
- US20220208621A1 Asymmetry Correction Via Oriented Wafer Loading Public/Granted day:2022-06-30
Information query
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