Invention Grant
- Patent Title: Package and display module
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Application No.: US17967681Application Date: 2022-10-17
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Publication No.: US11870022B2Publication Date: 2024-01-09
- Inventor: Shau-Yi Chen , Tzu-Yuan Lin , Wei-Chiang Hu , Pei-Hsuan Lan , Min-Hsun Hsieh
- Applicant: EPISTAR CORPORATION , Yenrich Technology Corporation
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION,YENRICH TECHNOLOGY CORPORATION
- Current Assignee: EPISTAR CORPORATION,YENRICH TECHNOLOGY CORPORATION
- Current Assignee Address: TW Hsinchu; TW Hsinchu
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L33/62 ; H01L27/15

Abstract:
A package includes a substrate, a first light-emitting unit, a second light-emitting unit, a light-transmitting layer, and a light-absorbing layer. The substrate has a first surface and an upper conductive layer on the first surface. The first light-emitting unit and the second light-emitting unit are disposed on the upper conductive layer. The first light-emitting unit has a first light-emitting surface and a first side wall. The second light-emitting unit has a second light-emitting surface and a second side wall. The light-transmitting layer is disposed on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit. The light-absorbing layer is disposed between the substrate and the light-transmitting layer, covers the upper conductive layer, the first side wall, and the second side wall, and exposes the first light-emitting surface and the second light-emitting surface.
Public/Granted literature
- US20230034763A1 PACKAGE AND DISPLAY MODULE Public/Granted day:2023-02-02
Information query
IPC分类: