Invention Grant
- Patent Title: Polyamide-imide film, preparation method thereof, and cover window comprising same
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Application No.: US16912942Application Date: 2020-06-26
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Publication No.: US11873372B2Publication Date: 2024-01-16
- Inventor: Han Jun Kim , Sunhwan Kim , Dae Seong Oh , Jin Woo Lee , Sang Hun Choi , Jung Hee Ki , Dong Jin Lim
- Applicant: SK microworks Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK MICROWORKS CO., LTD.
- Current Assignee: SK MICROWORKS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T GROUP LLP
- Priority: KR 20190078286 2019.06.28 KR 20190148770 2019.11.19 KR 20200037543 2020.03.27
- Main IPC: C08G73/14
- IPC: C08G73/14 ; C08J5/18 ; C08K3/26 ; C08K3/105 ; C08K3/16

Abstract:
Embodiments relate to a polyamide-imide film that maintains its mechanical properties at least at a certain level under the conditions of high temperatures and low temperatures and is excellent in transparency and folding characteristics, a process for preparing the same, and a cover window comprising the same. The polyamide-imide film comprises a polyamide-imide polymer and has an MOR value defined in Equation 1a of 75% or more.
Information query
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