Invention Grant
- Patent Title: Substrate comprising plasmonic continuous film with curved surface and manufacturing method thereof
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Application No.: US16750820Application Date: 2020-01-23
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Publication No.: US11873552B2Publication Date: 2024-01-16
- Inventor: Sung-Gyu Park , Do-Geun Kim , Seung-Hoon Lee , Dong-Ho Kim
- Applicant: Korea Institute of Materials Science
- Applicant Address: KR Gyeongsangnam-do
- Assignee: KOREA INSTITUTE OF MATERIALS SCIENCE
- Current Assignee: KOREA INSTITUTE OF MATERIALS SCIENCE
- Current Assignee Address: KR Gyeongsangnam-Do
- Agency: PEARNE & GORDON LLP
- Priority: KR 20190085971 2019.07.16
- Main IPC: B82Y20/00
- IPC: B82Y20/00 ; G02B5/00 ; C23C14/04 ; C23C14/20 ; C23C14/02 ; C23C14/28 ; C23C14/34 ; C23C14/16
Abstract:
A substrate including plasmonic continuous film with curved surface and a method for manufacturing the same. More particularly, a substrate for an ultrasensitive spectroscopic sensor includes bowl-shaped plasmonic curved nanodimples and spiked plasmonic nanotips formed at contact points between the nanodimples at the same time, thereby greatly increasing the total volume of hotspots and being capable of concentrating and analyzing an extremely small amount of a sample.
Public/Granted literature
- US20210017638A1 SUBSTRATE COMPRISING PLASMONIC CONTINUOUS FILM WITH CURVED SURFACE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-01-21
Information query
