公开(公告)号：US20250109480A1

公开(公告)日：2025-04-03

申请号：US18717554

申请日：2021-12-10

Applicant: KOREA INSTITUTE OF MATERIALS SCIENCE

Inventor： Sung-hoon JUNG ,  Do-geun KIM ,  Seung-hoon LEE ,  Joo-young PARK ,  Eun-yeon BYEON ,  Jun-yeong YANG

IPC: C23C14/20 ,  C23C14/02

Abstract: The present disclosure provides a low dielectric polymer substrate and a preparation method thereof. More specifically, the present disclosure provides a low dielectric polymer substrate to which metal or ceramic may be deposited with high adhesion without a separate adhesive layer through surface modification of a polymer substrate and a preparation method thereof.

公开(公告)号：US12036739B2

公开(公告)日：2024-07-16

申请号：US16627525

申请日：2019-07-18

Applicant: Korea Institute of Machinery & Materials

Inventor： Hui Suk Yun ,  Honghyun Park

IPC: B29C64/35 ,  B08B1/30 ,  B08B3/02 ,  B33Y40/00

CPC classification number: B29C64/35 ,  B08B1/30 ,  B08B3/02 ,  B33Y40/00

Abstract: The present invention is intended to provide a cleaning apparatus for a 3-dimensional (3D) printing structure and a cleaning method for a 3D printing structure. To this end, the present invention provides a cleaning apparatus for a 3D printing structure, the cleaning apparatus including a hygroscopic paper supply part supplying a hygroscopic paper while the wound film-type hygroscopic paper is unwound, a hygroscopic paper collecting part winding and collecting the film-type hygroscopic paper, a film-type hygroscopic paper moving in a direction from the supply part to the collecting part between the supply part and the collecting part according to a mutual operation of the supply part and the collecting part, and a support part disposed on an opposite surface of a hygroscopic paper surface, on which the 3D printing structure is disposed, with respect to the film-type hygroscopic paper, and a cleaning method for a 3D printing structure, and a cleaning method for a 3D printing structure. According to the present invention, the 3D printing apparatus may be cleaned by using a minimum amount of solvent, and the mixture between materials may be prevented to remarkably improve the quality and integrity of the 3D printing structure.

公开(公告)号：US11858820B2

公开(公告)日：2024-01-02

申请号：US16764768

申请日：2018-11-15

Applicant: KOREA INSTITUTE OF MATERIALS SCIENCE

Inventor： Chul Jin Choi ,  Ping Zhan Si ,  Ji Hoon Park ,  Hui Dong Qian

IPC: C01B32/914 ,  C01B32/182 ,  C01B32/158 ,  C01B32/20 ,  C01G45/00 ,  C22C22/00

CPC classification number: C01B32/914 ,  C01B32/158 ,  C01B32/182 ,  C01B32/20 ,  C01G45/00 ,  C22C22/00 ,  C01P2002/72 ,  C01P2006/42

Abstract: A manganese carbide (Mn4C) magnetic material and a production method therefor are provided. According to one embodiment, the saturation magnetization of the Mn4C magnetic material increases with increasing temperature, and thus the Mn4C magnetic material is applicable to fields in which thermally induced magnetization reduction is critical.

公开(公告)号：US20230416877A1

公开(公告)日：2023-12-28

申请号：US18035898

申请日：2021-11-09

Applicant: KOREA INSTITUTE OF MATERIALS SCIENCE

Inventor： Jeong Hyeon DO ,  In Soo KIM ,  Joong Eun JUNG ,  Baig Gyu CHOI ,  Woo Young SEOK ,  Yu Hwa LEE

IPC: C22C19/05

CPC classification number: C22C19/057

Abstract: Provided is a super-heat-resistant alloy consisting of aluminum (Al): 4.0 wt % to 5.2 wt %, cobalt (Co): 1.0 wt % to 10.0 wt %, chromium (Cr): 5.0 wt % to 8.0 wt %, molybdenum (Mo): 0.5 wt % to 2.0 wt %, tantalum (Ta): 7.0 wt % to 10.0 wt %, titanium (Ti): 0 wt %

公开(公告)号：US11665965B2

公开(公告)日：2023-05-30

申请号：US16595568

申请日：2019-10-08

Applicant: Korea Institute of Machinery & Materials

Inventor： Kyung Tae Kim ,  Byung Mun Jung

IPC: H01L35/26 ,  H01L35/34

CPC classification number: H01L35/26 ,  H01L35/34

Abstract: Disclosed is a composition for forming a thermoelectric film, the composition comprising an edge-oxidized graphene oxide, wherein the edge-oxidized graphene oxide is dispersed in a thermoelectric material.

公开(公告)号：US20230151986A1

公开(公告)日：2023-05-18

申请号：US18092363

申请日：2023-01-02

Applicant: KOREA INSTITUTE OF MATERIALS SCIENCE

Inventor： Seung-hoon LEE ,  Do-geun Kim ,  Chang-su Kim ,  Joo-young Park ,  Sung-hoon Jung ,  Joon-hwan Choi ,  Eun-yeon Byeon ,  Jong-man Lee ,  Jang-hoon Ha ,  Sang-jin Kim

IPC: F24F8/26 ,  F24F8/167 ,  F24F8/98 ,  F24F7/08 ,  F24F8/192 ,  A61L9/22

CPC classification number: F24F8/26 ,  F24F8/167 ,  F24F8/98 ,  F24F7/08 ,  F24F8/192 ,  A61L9/22 ,  A61L2209/14 ,  A61L2209/16

Abstract: The present disclosure relates to an air conditioning system and method for disinfection of a public facility. More specifically, the present disclosure relates to an air conditioning system and method for disinfection of a public facility capable of sterilizing or inactivating bio-aerosols existing in interior space by using the air conditioning equipment installed in the public facility structures.

公开(公告)号：US12250801B2

公开(公告)日：2025-03-11

申请号：US18284720

申请日：2022-08-02

Applicant: KOREA INSTITUTE OF MATERIALS SCIENCE

Inventor： Byeong Jin Park ,  Tae Hoon Kim ,  Sang Bok Lee ,  Byung Mun Jung ,  Seung Han Ryu ,  Yu Kyung Han ,  Suk Jin Kwon

IPC: H05K9/00 ,  H01Q17/00

Abstract: The present invention provides an electromagnetic wave-absorbing composite material and a manufacturing method therefor, the electromagnetic wave-absorbing composite material comprising: a polymer composite including a refractive index-adjusting material therein; and a plurality of conductive wires formed on at least one surface of the polymer composite, wherein electromagnetic waves reflected in a matching frequency (f) range derived through Mathematical Formulas 1 to 3 described in the present invention are 0.2 dB or less.

公开(公告)号：US20240055266A1

公开(公告)日：2024-02-15

申请号：US18244863

申请日：2023-09-11

Applicant: KOREA INSTITUTE OF MATERIALS SCIENCE

Inventor： Young Jo PARK ,  Ha Neul KIM ,  Jae Woong KO ,  Mi Ju KIM ,  Hyeon Myeong OH

IPC: H01L21/3065 ,  H01J37/32 ,  B22F3/10

CPC classification number: H01L21/3065 ,  H01J37/32009 ,  B22F3/10 ,  H01J2237/334

Abstract: Provided is a method of using a plasma etching apparatus in semiconductor manufacturing, the method including using a plasma etching apparatus in semiconductor manufacturing, the plasma etching apparatus comprising a component including a composite sintered body therein, wherein the composite sintered body comprises 30 vol % to 70 vol % of yttria (Y2O3) and 30 vol % to 70 vol % of magnesia (MgO), and wherein the component has plasma resistance. In addition, provided is a method of reducing etching by plasma in a plasma etching apparatus during semiconductor manufacturing, the method including providing a plasma etching apparatus for manufacturing a semiconductor including a component including a composite sintered body, wherein the composite sintered body comprises 30 vol % to 70 vol % of yttria (Y2O3) and 30 vol % to 70 vol % of magnesia (MgO), and wherein the component has plasma resistance.

公开(公告)号：US11873552B2

公开(公告)日：2024-01-16

申请号：US16750820

申请日：2020-01-23

Applicant: Korea Institute of Materials Science

Inventor： Sung-Gyu Park ,  Do-Geun Kim ,  Seung-Hoon Lee ,  Dong-Ho Kim

IPC: B82Y20/00 ,  G02B5/00 ,  C23C14/04 ,  C23C14/20 ,  C23C14/02 ,  C23C14/28 ,  C23C14/34 ,  C23C14/16

CPC classification number: C23C14/046 ,  B82Y20/00 ,  C23C14/028 ,  C23C14/16 ,  C23C14/20 ,  C23C14/28 ,  C23C14/3442 ,  G02B5/008

Abstract: A substrate including plasmonic continuous film with curved surface and a method for manufacturing the same. More particularly, a substrate for an ultrasensitive spectroscopic sensor includes bowl-shaped plasmonic curved nanodimples and spiked plasmonic nanotips formed at contact points between the nanodimples at the same time, thereby greatly increasing the total volume of hotspots and being capable of concentrating and analyzing an extremely small amount of a sample.

公开(公告)号：US11841325B2

公开(公告)日：2023-12-12

申请号：US17242661

申请日：2021-04-28

Applicant: KOREA INSTITUTE OF MATERIALS SCIENCE

Inventor： Sung-gyu Park ,  Dong-ho Kim ,  Ho-sang Jung ,  Mijeong Kang ,  Iris Baffour Ansah

IPC: G01N21/65 ,  G01J3/44 ,  B82Y30/00 ,  B82Y40/00 ,  B82Y10/00

CPC classification number: G01N21/658 ,  G01J3/44 ,  B82Y10/00 ,  B82Y30/00 ,  G01N2021/655

Abstract: There are provided a substrate including a three-dimensional (3D) nanoplasmonic composite structure, a method of fabricating the same, and a rapid analysis method using the same. More specifically, there are provided a substrate including a 3D plasmonic-nanostructure/target-molecule composite thin film composed of an analyte and a plasmonic nanostructure and formed by applying a voltage to a plasmonic electrode in an electrochemical cell including an analyte and a metal precursor to induce an analyte molecule on the electrode and performing electrochemical deposition (or electrodeposition), a method of fabricating the same, and a rapid analysis method using the same.