Invention Grant
- Patent Title: Metal gate structure and method of fabricating the same
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Application No.: US17523946Application Date: 2021-11-11
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Publication No.: US11881518B2Publication Date: 2024-01-23
- Inventor: Jie-Ning Yang , Wen-Tsung Chang , Po-Wen Su , Kuan-Ying Lai , Bo-Yu Su , Chun-Mao Chiou , Yao-Jhan Wang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW 7139307 2018.11.06
- The original application number of the division: US16205174 2018.11.29
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/423 ; H01L29/66 ; H01L21/8234 ; H01L21/768 ; H01L29/417

Abstract:
A gate structure includes a substrate divided into an N-type transistor region and a P-type transistor region. An interlayer dielectric covers the substrate. A first trench is embedded in the interlayer dielectric within the N-type transistor region. A first gate electrode having a bullet-shaped profile is disposed in the first trench. A gate dielectric contacts the first trench. An N-type work function layer is disposed between the gate dielectric layer and the first gate electrode. A second trench is embedded in the interlayer dielectric within the P-type transistor region. A second gate electrode having a first mushroom-shaped profile is disposed in the second trench. The gate dielectric layer contacts the second trench. The N-type work function layer is disposed between the gate dielectric layer and the second gate electrode. A first P-type work function layer is disposed between the gate dielectric layer and the N-type work function layer.
Public/Granted literature
- US20220069102A1 METAL GATE STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-03-03
Information query
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