Invention Grant
- Patent Title: Chemical mechanical polishing using time share control
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Application No.: US17716941Application Date: 2022-04-08
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Publication No.: US11883923B2Publication Date: 2024-01-30
- Inventor: Jimin Zhang , Jianshe Tang , Brian J. Brown , Wei Lu , Priscilla Diep LaRosa
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- The original application number of the division: US16688604 2019.11.19
- Main IPC: B24B37/005
- IPC: B24B37/005 ; H01L21/321 ; H01L21/306 ; B24B37/26
Abstract:
A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.
Public/Granted literature
- US11931854B2 Chemical mechanical polishing using time share control Public/Granted day:2024-03-19
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