公开(公告)号：US20240075583A1

公开(公告)日：2024-03-07

申请号：US18505871

申请日：2023-11-09

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC: B24B37/26 ,  B24B37/005 ,  B24B37/04 ,  B24B37/27

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/042 ,  B24B37/27

Abstract: A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

公开(公告)号：US11823916B2

公开(公告)日：2023-11-21

申请号：US17091105

申请日：2020-11-06

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02087 ,  H01L21/67248 ,  H01L21/68721

Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

公开(公告)号：US20220148892A1

公开(公告)日：2022-05-12

申请号：US17091105

申请日：2020-11-06

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02

Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

公开(公告)号：US20180079048A1

公开(公告)日：2018-03-22

申请号：US15703740

申请日：2017-09-13

Applicant: Applied Materials, Inc.

Inventor： Shih-Haur Shen ,  Jianshe Tang ,  Jimin Zhang ,  David Maxwell Gage

IPC: B24B37/013

CPC classification number: B24B37/013 ,  B24B37/105 ,  B24B37/205 ,  B24B37/22 ,  B24B49/12

Abstract: During polishing of a substrate a first signal is received from a first in-situ monitoring system and a second signal is received from a second in-situ monitoring system. A clearance time at which a conductive layer is cleared and a top surface of an underlying dielectric layer of the substrate exposed and determine based on the first signal. An initial value of the second signal at the determined clearance time is determined. An offset is added to the initial value to generate a threshold value, and a polishing endpoint is triggered when the second signal crosses the threshold value.

公开(公告)号：US11780045B2

公开(公告)日：2023-10-10

申请号：US16440785

申请日：2019-06-13

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  David Maxwell Gage ,  Harry Q. Lee ,  Kun Xu ,  Jimin Zhang

IPC: B24B37/005 ,  G01B7/06 ,  B24B49/10 ,  B24B37/27

CPC classification number: B24B37/005 ,  B24B37/27 ,  B24B49/105 ,  G01B7/10

Abstract: A method of chemical mechanical polishing includes bringing a substrate having a conductive layer disposed over a semiconductor wafer into contact with a polishing pad, generating relative motion between the substrate and the polishing pad, monitoring the substrate with an in-situ electromagnetic induction monitoring system as the conductive layer is polished to generate a sequence of signal values that depend on a thickness of the conductive layer, determining a sequence of thickness values for the conductive layer based on the sequence of signal values, and at least partially compensating for a contribution of conductivity of the semiconductor wafer to the signal values.

公开(公告)号：US10350723B2

公开(公告)日：2019-07-16

申请号：US15703740

申请日：2017-09-13

Applicant: Applied Materials, Inc.

Inventor： Shih-Haur Shen ,  Jianshe Tang ,  Jimin Zhang ,  David Maxwell Gage

IPC: B24B37/013 ,  B24B37/10 ,  B24B37/20 ,  B24B37/22 ,  B24B49/12

Abstract: During polishing of a substrate a first signal is received from a first in-situ monitoring system and a second signal is received from a second in-situ monitoring system. A clearance time at which a conductive layer is cleared and a top surface of an underlying dielectric layer of the substrate exposed and determine based on the first signal. An initial value of the second signal at the determined clearance time is determined. An offset is added to the initial value to generate a threshold value, and a polishing endpoint is triggered when the second signal crosses the threshold value.

公开(公告)号：US20130309951A1

公开(公告)日：2013-11-21

申请号：US13948547

申请日：2013-07-23

Applicant: Applied Materials, Inc.

Inventor： Dominic J. Benvegnu ,  Jimin Zhang ,  Thomas H. Osterheld ,  Boguslaw A. Swedek

IPC: B24B37/20

CPC classification number: B24B37/205 ,  B24B37/013

Abstract: A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.

Abstract translation: 描述了具有抛光层的抛光垫，抛光层具有抛光表面，在抛光层的与抛光层相对的一侧上的粘合剂层以及延伸穿过模制到抛光层的固体透光窗。 窗口具有与抛光表面共面的顶表面和与粘合剂层的下表面共面的底表面。 制造抛光垫的方法包括通过抛光层和粘合剂层形成孔，将背衬片固定在与抛光层的抛光表面相对的一侧上的粘合剂层上，将液体聚合物分配到孔中，并固化 液体聚合物形成窗口。

公开(公告)号：US20250114903A1

公开(公告)日：2025-04-10

申请号：US18483973

申请日：2023-10-10

Applicant: Applied Materials, Inc.

Inventor： Chen-Wei Chang ,  Priscilla Diep ,  Jimin Zhang ,  Taketo Sekine ,  Jianshe Tang ,  Haosheng Wu

IPC: B24B37/30 ,  B24B37/04

Abstract: Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a flexible membrane coupled with the carrier body. The flexible membrane may include a substrate-receiving surface that faces away from the carrier body. The substrate-receiving surface may include a plurality of gripping elements that protrude away from the substrate-receiving surface. Each of the plurality of gripping elements may have a maximum lateral dimension that is no greater than 2 mm.

公开(公告)号：US11951589B2

公开(公告)日：2024-04-09

申请号：US16953139

申请日：2020-11-19

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC: B24B37/26 ,  B24B37/005 ,  B24B37/04 ,  B24B37/27

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/042 ,  B24B37/27

Abstract: A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

公开(公告)号：US11764069B2

公开(公告)日：2023-09-19

申请号：US17335868

申请日：2021-06-01

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Brian J. Brown ,  Eric Lau ,  Ekaterina Mikhaylichenko ,  Jeonghoon Oh ,  Gerald J. Alonzo

IPC: H01L21/321 ,  B24B37/10 ,  H01L21/306 ,  B24B37/04

CPC classification number: H01L21/3212 ,  B24B37/042 ,  B24B37/107 ,  H01L21/30625

Abstract: Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.