Invention Grant
- Patent Title: SMA resin formulation
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Application No.: US17845720Application Date: 2022-06-21
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Publication No.: US11891475B2Publication Date: 2024-02-06
- Inventor: Edward Kelley , Teck Kai Wong , Rebekah F. Theisen , Christopher G. Clark, Jr.
- Applicant: ISOLA USA CORP.
- Applicant Address: US AZ Chandler
- Assignee: Isola USA Corp.
- Current Assignee: Isola USA Corp.
- Current Assignee Address: US AZ Chandler
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: B32B3/10
- IPC: B32B3/10 ; C08G59/42 ; C08L35/06 ; C08G59/62 ; C08L63/00 ; C08J5/24
Abstract:
Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
Public/Granted literature
- US20230141772A1 SMA Resin Formulation Public/Granted day:2023-05-11
Information query
