公开(公告)号：US11891475B2

公开(公告)日：2024-02-06

申请号：US17845720

申请日：2022-06-21

Applicant: ISOLA USA CORP.

Inventor： Edward Kelley ,  Teck Kai Wong ,  Rebekah F. Theisen ,  Christopher G. Clark, Jr.

IPC: B32B3/10 ,  C08G59/42 ,  C08L35/06 ,  C08G59/62 ,  C08L63/00 ,  C08J5/24

CPC classification number: C08G59/4215 ,  C08G59/621 ,  C08J5/244 ,  C08J5/249 ,  C08L35/06 ,  C08L63/00 ,  C08J2325/14 ,  C08J2335/06 ,  C08J2463/02 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2312/00 ,  C08L63/00 ,  C08K3/34 ,  C08K3/36 ,  C08L35/06

Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.

公开(公告)号：US20230127186A1

公开(公告)日：2023-04-27

申请号：US18088059

申请日：2022-12-23

Applicant: ISOLA USA CORP.

Inventor： Roland Schönholz

IPC: H05K1/18 ,  B32B5/26 ,  H05K3/28 ,  B32B5/02 ,  H05K3/46

Abstract: Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.

公开(公告)号：US11558962B2

公开(公告)日：2023-01-17

申请号：US16853722

申请日：2020-04-20

Applicant: ISOLA USA CORP.

Inventor： Roland Schönholz

IPC: H05K3/30 ,  H05K1/18 ,  B32B5/26 ,  H05K3/28 ,  B32B5/02 ,  H05K3/46

Abstract: Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.

公开(公告)号：US11365282B2

公开(公告)日：2022-06-21

申请号：US16320282

申请日：2017-07-25

Applicant: ISOLA USA CORP.

Inventor： Edward Kelley ,  Teck Kai Wong ,  Rebekah F. Theisen ,  Christopher G. Clark, Jr.

IPC: B32B3/10 ,  C08G59/42 ,  C08J5/24 ,  C08L35/06 ,  C08G59/62 ,  C08L63/00

Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.

公开(公告)号：US20190270873A1

公开(公告)日：2019-09-05

申请号：US16320282

申请日：2017-07-25

Applicant: ISOLA USA CORP.

Inventor： Edward Kelley ,  Teck Kai Wong ,  Rebekah F. Theisen ,  Christopher G. Clark, Jr.

IPC: C08L25/14 ,  C08L35/06 ,  C08J5/24 ,  H05K1/03

Abstract: Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.

公开(公告)号：US10364332B2

公开(公告)日：2019-07-30

申请号：US15786131

申请日：2017-10-17

Applicant: Isola USA Corp.

Inventor： David Bedner ,  Tarun Amla

IPC: C08J5/24 ,  H05K1/03 ,  H05K3/00 ,  C09D163/00 ,  C09D163/04 ,  H05K1/18 ,  B32B15/092 ,  B32B15/20 ,  C08G59/32 ,  C08G59/50 ,  C08L63/00 ,  C08L63/04 ,  C09J163/00 ,  C09J163/04 ,  B05D7/14

Abstract: Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.

公开(公告)号：US20190208628A1

公开(公告)日：2019-07-04

申请号：US16056131

申请日：2018-08-06

Applicant: Isola USA Corp.

Inventor： Tarun Amla ,  Johann R. Schumacher ,  Sascha Kreuer ,  Peggy Conn ,  Stanley E. Wilson

IPC: H05K1/03 ,  C08J5/24 ,  H01B3/40

CPC classification number: H05K1/0366 ,  C08J5/24 ,  C08J2300/22 ,  C08J2300/24 ,  H01B3/40 ,  H05K1/024 ,  H05K1/0248 ,  H05K1/0373 ,  H05K2201/0195 ,  Y10T428/24802 ,  Y10T428/2481 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.

公开(公告)号：US10307989B2

公开(公告)日：2019-06-04

申请号：US15693001

申请日：2017-08-31

Applicant: ISOLA USA CORP.

Inventor： Roland Schönholz

IPC: B32B37/06 ,  B32B15/08 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  B32B37/00 ,  B32B37/02 ,  B32B37/26 ,  H05K3/46 ,  B32B38/10 ,  H05K1/02 ,  B32B37/14 ,  H05K1/11 ,  H05K1/14 ,  B32B37/30 ,  H05K3/42

Abstract: Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.

公开(公告)号：US20170127525A1

公开(公告)日：2017-05-04

申请号：US15403253

申请日：2017-01-11

Applicant: ISOLA USA CORP.

Inventor： Roland Schönholz

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/28

CPC classification number: H05K1/186 ,  B32B5/024 ,  B32B5/26 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/77 ,  B32B2307/41 ,  B32B2307/412 ,  B32B2457/08 ,  H05K3/284 ,  H05K3/4611 ,  H05K2201/0195

Abstract: Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.

公开(公告)号：US20140011962A1

公开(公告)日：2014-01-09

申请号：US13840056

申请日：2013-03-15

Applicant: ISOLA USA CORP.

Inventor： Guroen He ,  Tarun Amla ,  Larry D. Olson ,  Peggy Conn

IPC: C08F36/04

CPC classification number: C09D153/02 ,  C08C19/22 ,  C08F36/04 ,  C08F36/06 ,  C08F271/02 ,  C08F279/02 ,  C08F2810/20 ,  C08K5/00 ,  C08K5/0066 ,  C08K5/14 ,  C08K5/3415 ,  C09D109/00 ,  C09D109/06 ,  C09D147/00 ,  C09D151/003 ,  C09D151/04 ,  Y10T428/31681 ,  Y10T442/2992 ,  C09D121/00 ,  C08K5/20 ,  C08F222/40

Abstract: Synthesized base resin compositions that include a raw resin and a maleimide and/or bismaleimide monomer as well as compounded varnishes that include a raw resin or synthesized base resin as well as a monomer, flame retardant and initiator as well as prepregs and laminates made using the synthesized base resin and compounded varnishes.