Invention Grant
- Patent Title: Method of manufacturing a light-emitting device
-
Application No.: US17397388Application Date: 2021-08-09
-
Publication No.: US11901480B2Publication Date: 2024-02-13
- Inventor: Chien-Fu Huang , Chih-Chiang Lu , Chun-Yu Lin , Hsin-Chih Chiu
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION
- Current Assignee: EPISTAR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: DITTHAVONG, STEINER & MLOTKOWSKI
- The original application number of the division: US16883742 2020.05.26
- Main IPC: H01L33/02
- IPC: H01L33/02 ; H01L33/62 ; H01L25/075 ; H01L21/66 ; H01L23/00 ; H01L33/36

Abstract:
The present disclosure provides a light-emitting device comprising a substrate with a topmost surface; a first semiconductor stack arranged on the substrate, and comprising a first top surface separated from the topmost surface by a first distance; a first bonding layer arranged between the substrate and the first semiconductor stack; a second semiconductor stack arranged on the substrate, and comprising a second top surface separated from the topmost surface by a second distance which is different form the first distance; a second bonding layer arranged between the substrate and the second semiconductor stack; a third semiconductor stack arranged on the substrate, and comprising third top surface separated from the topmost surface by a third distance; and a third bonding layer arranged between the substrate and the third semiconductor stack; wherein the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are configured to emit different color lights.
Public/Granted literature
- US20210367098A1 LIGHT-EMITTING DEVICE Public/Granted day:2021-11-25
Information query
IPC分类: