Invention Grant
- Patent Title: Optical chips mounted on a deformed carrier
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Application No.: US16768594Application Date: 2018-12-13
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Publication No.: US11942572B2Publication Date: 2024-03-26
- Inventor: Siegfried Herrmann , Michael Völkl
- Applicant: OSRAM OLED GMBH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GMBH
- Current Assignee: OSRAM OLED GMBH
- Current Assignee Address: DE Regensburg
- Agency: ArentFox Schiff LLP
- Priority: DE 2017129975.0 2017.12.14
- International Application: PCT/EP2018/084804 2018.12.13
- International Announcement: WO2019/115713A 2019.06.20
- Date entered country: 2020-05-29
- Main IPC: H01L33/20
- IPC: H01L33/20 ; F21K9/90 ; H01L23/00 ; H01L25/075 ; H01L33/52 ; H01L33/64 ; H05K1/05 ; H05K3/00 ; H05K3/28 ; H10K19/00 ; H10K50/10 ; F21Y115/10
Abstract:
The invention relates to a method for producing a semiconductor component comprising a radiation-emitting optical semiconductor chip or a plurality of radiation-emitting optical semiconductor chips, said method comprising: applying the radiation-emitting optical semiconductor chip or the plurality of radiation-emitting optical semiconductor chips to a deformable flat support deforming the support; and permanently fixing the deformation.
Public/Granted literature
- US20210091263A1 METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR COMPONENT Public/Granted day:2021-03-25
Information query
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