A sample support includes: a substrate having a plurality of through-holes opening on a first surface and on a second surface; a first member having a plurality of first openings and disposed on the first surface; a second member having a plurality of second openings and disposed on the second surface, and; a bonding member disposed between the first member and the second member; and a conductive layer integrally provided on a region of the second surface corresponding to each of the plurality of second openings. The plurality of through-holes include a plurality of first through-holes located between each of the plurality of first openings and each of the plurality of second openings, and a plurality of second through-holes located between the first member and the second member. Each of the plurality of second openings communicate with each of the plurality of first openings through the plurality of first through-holes.