Invention Grant
- Patent Title: Analyzing in-plane distortion
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Application No.: US18130500Application Date: 2023-04-04
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Publication No.: US11948846B2Publication Date: 2024-04-02
- Inventor: Wenjiao Wang , Joshua Maher , Xinhai Han , Deenesh Padhi , Tza-Jing Gung
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- The original application number of the division: US17087976 2020.11.03
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G03F7/00 ; G06F30/398

Abstract:
Methods and systems are described for generating assessment maps. A method includes receiving a first vector map comprising a first set of vectors each indicating a distortion of a particular location on a substrate and generating a second vector map indicating a change in direction of a magnitude of the distortion of the particular location on the substrate. The method further includes generating a third vector map comprising vectors reflecting reduced noise in distortions across the plurality of locations on the substrate and generating a fourth vector map projecting a direction component of each vector component in the third set of vectors to a radial direction. The method further includes generating a fifth vector map by grouping the vectors of the fourth set of vectors and determining a magnitude associated with each group of vectors.
Public/Granted literature
- US20230238289A1 ANALYZING IN-PLANE DISTORTION Public/Granted day:2023-07-27
Information query
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