Invention Grant
- Patent Title: Light receiving module comprising stem and block on an upper surface of the stem
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Application No.: US17760163Application Date: 2020-07-06
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Publication No.: US11953375B2Publication Date: 2024-04-09
- Inventor: Kazuki Yamaji
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2020/026367 2020.07.06
- International Announcement: WO2022/009259A 2022.01.13
- Date entered country: 2022-08-04
- Main IPC: G01J1/44
- IPC: G01J1/44 ; G01J1/46 ; H01L23/66 ; H01L31/02 ; H01L31/0203 ; H01L31/0232 ; H01P3/08

Abstract:
A plurality of lead pins (2a-d) penetrates through a stem (1) having a circular shape and includes a signal lead pin (2a,2b). A block (4) is provided on an upper surface of the stem. A waveguide light receiving device (9) is provided on a side surface of the block. An amplifier (6) is provided on the side surface of the block and amplifies an electric signal output from the waveguide light receiving device. A first relay substrate is provided on the upper surface of the stem and arranged between the block and the signal lead pin. A first transmission line (12a,12b) is provided on the first relay substrate. A first wire (10f,10g) connects one end of the first transmission line and an output terminal of the amplifier. A second wire (10h,10i) connects the other end of the first transmission line (12a,12b) and the signal lead pin.
Public/Granted literature
- US20230051355A1 LIGHT RECEIVING MODULE Public/Granted day:2023-02-16
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