Invention Grant
- Patent Title: Regulator circuit package techniques
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Application No.: US17313845Application Date: 2021-05-06
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Publication No.: US11955437B2Publication Date: 2024-04-09
- Inventor: Leonard Shtargot , Zafer Kutlu , John Underhill Gardner
- Applicant: Analog Devices International Unlimited Company
- Applicant Address: IE Limerick
- Assignee: Analog Devices International Unlimited Company
- Current Assignee: Analog Devices International Unlimited Company
- Current Assignee Address: IE Limerick
- Agency: Schwegman Lundberg & Woessner, P.A.
- The original application number of the division: US16193843 2018.11.16
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/3205 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L23/367 ; H01L23/538 ; H01L25/16 ; H01L27/02 ; H01L27/06 ; H02M1/08
Abstract:
Techniques are provided for containing magnetic fields generated by an integrated switching package and for reducing electromagnetic interference generated from an integrated switching package.
Public/Granted literature
- US20210257313A1 REGULATOR CIRCUIT PACKAGE TECHNIQUES Public/Granted day:2021-08-19
Information query
IPC分类:
