Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having germanium nanowire channel structures
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Application No.: US17985112Application Date: 2022-11-10
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Publication No.: US11978784B2Publication Date: 2024-05-07
- Inventor: Cory Bomberger , Anand Murthy , Susmita Ghose , Zachary Geiger
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L29/06 ; H01L29/08 ; H01L29/34 ; H01L29/78 ; H01L29/423

Abstract:
Gate-all-around integrated circuit structures having germanium nanowire channel structures, and methods of fabricating gate-all-around integrated circuit structures having germanium nanowire channel structures, are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires above a fin, each of the nanowires including germanium, and the fin including a defect modification layer on a first semiconductor layer, a second semiconductor layer on the defect modification layer, and a third semiconductor layer on the second semiconductor layer. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires, and a second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal nanowires.
Public/Granted literature
- US20230071989A1 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING GERMANIUM NANOWIRE CHANNEL STRUCTURES Public/Granted day:2023-03-09
Information query
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