Invention Grant
- Patent Title: Ceramic circuit board, heat-dissipating member, and aluminum-diamond composite
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Application No.: US17791971Application Date: 2021-03-25
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Publication No.: US11983586B2Publication Date: 2024-05-14
- Inventor: Daisuke Goto , Hiroaki Ota
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 20055457 2020.03.26
- International Application: PCT/JP2021/012500 2021.03.25
- International Announcement: WO2021/193810A 2021.09.30
- Date entered country: 2022-07-11
- Main IPC: G06K19/02
- IPC: G06K19/02 ; B32B3/30 ; B32B7/08 ; B32B7/12 ; B32B15/01 ; B32B15/04 ; B32B18/00 ; G06K19/06 ; H01L23/498 ; H01L23/544 ; H05K1/02 ; H05K7/20
Abstract:
A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.
Public/Granted literature
- US20230042932A1 CERAMIC CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND ALUMINUM-DIAMOND COMPOSITE Public/Granted day:2023-02-09
Information query
