Invention Grant
- Patent Title: Field emission device, field emission method and positioning and fixing method
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Application No.: US18008016Application Date: 2021-05-26
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Publication No.: US11990308B2Publication Date: 2024-05-21
- Inventor: Takumi Hayashi , Rena Takahashi , Hayato Ochi
- Applicant: MEIDENSHA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MEIDENSHA CORPORATION
- Current Assignee: MEIDENSHA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 20098126 2020.06.05
- International Application: PCT/JP2021/019937 2021.05.26
- International Announcement: WO2021/246254A 2021.12.09
- Date entered country: 2022-12-02
- Main IPC: H01J35/06
- IPC: H01J35/06 ; H01J1/304 ; H01J19/24

Abstract:
Opening edge surface (45a) of an emitter supporting unit female screw bore (45) provided at an emitter supporting unit (4) extends along radial direction of the emitter supporting unit female screw bore (45). An emitter supporting unit operation hole (32) provided at a flange portion (30a) of a vacuum enclosure (11) has shape into which one selected from a position adjustment shaft (6) and a pressing shaft (9) can be inserted from their shaft tip sides. The position adjustment shaft is provided, on an outer circumferential surface of its tip (61), with a tip side male screw portion (61a) that can be screwed into the emitter supporting unit female screw bore (45). The pressing shaft has, at its tip (91), a tip surface (91a) having a larger diameter than an opening diameter of the emitter supporting unit female screw bore (45) and extending along radial direction of the pressing shaft.
Public/Granted literature
- US20230197395A1 FIELD EMISSION DEVICE, FIELD EMISSION METHOD AND POSITIONING AND FIXING METHOD Public/Granted day:2023-06-22
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