Invention Grant
- Patent Title: Chiplets with connection posts
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Application No.: US17984748Application Date: 2022-11-10
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Publication No.: US11990438B2Publication Date: 2024-05-21
- Inventor: Carl Prevatte , Christopher Bower , Ronald S. Cok , Matthew Meitl
- Applicant: X Display Company Technology Limited
- Applicant Address: IE Dublin
- Assignee: X Display Company Technology Limited
- Current Assignee: X Display Company Technology Limited
- Current Assignee Address: IE Dublin
- Agency: Choate, Hall & Stewart LLP
- Agent William R. Haulbrook; Michael D. Schmitt
- The original application number of the division: US14822864 2015.08.10
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H05K1/11 ; H05K3/30 ; H05K3/34

Abstract:
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
Public/Granted literature
- US20230146788A1 CHIPLETS WITH CONNECTION POSTS Public/Granted day:2023-05-11
Information query
IPC分类: