Invention Grant
- Patent Title: Lift pin assembly
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Application No.: US17227066Application Date: 2021-04-09
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Publication No.: US12002703B2Publication Date: 2024-06-04
- Inventor: Yogananda Sarode Vishwanath , Anand Kumar
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: PATTERSON + SHERIDAN, LLP
- Agent Chad M. Dougherty
- Priority: IN 1741025813 2017.07.20
- The original application number of the division: US16010250 2018.06.15
- Main IPC: H01L21/687
- IPC: H01L21/687 ; C23C16/44 ; H01J37/32 ; H01L21/67 ; H01L21/683
Abstract:
Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethrough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.
Public/Granted literature
- US20210233799A1 LIFT PIN ASSEMBLY Public/Granted day:2021-07-29
Information query
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