Invention Grant
- Patent Title: High-capacity computer modules
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Application No.: US16889041Application Date: 2020-06-01
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Publication No.: US12016123B2Publication Date: 2024-06-18
- Inventor: Brett W. Degner , Michael E. Leclerc , Eric R. Prather , Scott J. Campbell , James M. Cuseo , Rodrigo Dutervil Mubarak , Ian A. Guy , Daniel D. Hershey , Mariel L. Lanas , Michael D. McBroom , David C. Parell , Bartley K. Andre , Danny L. McBroom , Houtan R. Farahani
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K5/02 ; H05K7/14 ; H05K7/20
Abstract:
Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.
Public/Granted literature
- US20200383206A1 HIGH-CAPACITY COMPUTER MODULES Public/Granted day:2020-12-03
Information query
