公开(公告)号：US20200383206A1

公开(公告)日：2020-12-03

申请号：US16889041

申请日：2020-06-01

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Michael E. Leclerc ,  Eric R. Prather ,  Scott J. Campbell ,  James M. Cuseo ,  Rodrigo Dutervil Mubarak ,  Ian A. Guy ,  Daniel D. Hershey ,  Mariel L. Lanas ,  Michael D. McBroom ,  David C. Parell ,  Bartley K. Andre ,  Danny L. McBroom ,  Houtan R. Farahani

IPC: H05K1/14 ,  H05K5/02 ,  H05K7/14 ,  H05K7/20

Abstract: Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.

公开(公告)号：US20240395660A1

公开(公告)日：2024-11-28

申请号：US18200365

申请日：2023-05-22

Applicant: Apple Inc.

Inventor： Halil Berberoglu ,  Cheng P. Tan ,  Jifang Tian ,  Chetan Harsha Edara ,  Pavan Kumar Varma Buddaraju ,  Scott J. Campbell

IPC: H01L23/427

Abstract: A thermal management module for an integrated circuit assembly includes a housing defining a configured to receive a fluid and having a variable cross-sectional area. The thermal management module also includes a wick disposed within the sealed passage, where the wick forms pores configured to convey a liquid form of the fluid toward an evaporator section of the thermal management module. The thermal management module also includes a void formed within the sealed passage between the wick and a wall of the housing, wherein the void is configured to convey a vapor form of the fluid toward a condenser section of the thermal management module.

公开(公告)号：US12016123B2

公开(公告)日：2024-06-18

申请号：US16889041

申请日：2020-06-01

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Michael E. Leclerc ,  Eric R. Prather ,  Scott J. Campbell ,  James M. Cuseo ,  Rodrigo Dutervil Mubarak ,  Ian A. Guy ,  Daniel D. Hershey ,  Mariel L. Lanas ,  Michael D. McBroom ,  David C. Parell ,  Bartley K. Andre ,  Danny L. McBroom ,  Houtan R. Farahani

IPC: H05K1/14 ,  H05K5/02 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K1/141 ,  H05K5/0273 ,  H05K5/0295 ,  H05K7/1405 ,  H05K7/1409 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209

Abstract: Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.

公开(公告)号：US20240105639A1

公开(公告)日：2024-03-28

申请号：US17951978

申请日：2022-09-23

Applicant: Apple Inc.

Inventor： Helia Rahmani ,  Stephane J. Marcadet ,  Scott J. Campbell ,  Zhiyong C. Xia ,  Stephen V. Jayanathan ,  Vineet Negi ,  Christian Kettenbeil

IPC: H01L23/00 ,  H01L23/053 ,  H05K1/18 ,  H05K5/00

CPC classification number: H01L23/562 ,  H01L23/053 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0091 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10734

Abstract: Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.