Invention Grant
- Patent Title: Integrated circuit die test architecture
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Application No.: US18226924Application Date: 2023-07-27
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Publication No.: US12025649B2Publication Date: 2024-07-02
- Inventor: Lee D. Whetsel
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Carl G. Peterson; Frank D. Cimino
- The original application number of the division: US17858122 2022.07.06
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/3177 ; G01R31/3185

Abstract:
A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.
Public/Granted literature
- US20230366920A1 INTEGRATED CIRCUIT DIE TEST ARCHITECTURE Public/Granted day:2023-11-16
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