Invention Grant
- Patent Title: Solid-state image sensor
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Application No.: US17379150Application Date: 2021-07-19
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Publication No.: US12027547B2Publication Date: 2024-07-02
- Inventor: Hao-Wei Liu , Chia-Chien Hsieh , Sheng-Chuan Cheng , Ching-Chiang Wu
- Applicant: VisEra Technologies Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
- Current Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
- Current Assignee Address: TW Hsin-Chu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A solid-state image sensor is provided. The solid-state image sensor includes photoelectric conversion elements. The solid-state image sensor also includes a mosaic pattern layer disposed above the photoelectric conversion elements. The mosaic pattern layer includes an infrared-passing segment and color filter segments disposed on the periphery of the infrared-passing segment. The solid-state image sensor further includes a first condensing structure disposed on the mosaic pattern layer. The infrared-passing segment and the color filter segments share the first condensing structure.
Public/Granted literature
- US20230020741A1 SOLID-STATE IMAGE SENSOR Public/Granted day:2023-01-19
Information query
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