Invention Grant
- Patent Title: Device with multi-channel bonding
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Application No.: US17659281Application Date: 2022-04-14
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Publication No.: US12028168B2Publication Date: 2024-07-02
- Inventor: Ingo Volkening , Amos Klimker , Rafi Abraham
- Applicant: MAXLINEAR, INC.
- Applicant Address: US CA Carlsbad
- Assignee: MaxLinear, Inc.
- Current Assignee: MaxLinear, Inc.
- Current Assignee Address: US CA Carlsbad
- Agency: Buchalter
- Agent Jason W. Croft
- Main IPC: H04L1/1829
- IPC: H04L1/1829 ; H04L1/1607

Abstract:
A system may include primary and secondary integrated circuits. The primary integrated circuit may receive a first subset of data packets associated with a first set of sequence numbers. The secondary integrated circuit may receive a second subset of data packets associated with a second set of sequence numbers. The primary integrated circuit is configured to manage the first set of sequence numbers and the second set of sequence numbers on behalf of the secondary integrated circuit and for the system.
Public/Granted literature
- US20220337354A1 DEVICE WITH MULTI-CHANNEL BONDING Public/Granted day:2022-10-20
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