A ceramic carrier substrate for an electrical/electronic circuit. The substrate includes ceramic layers arranged one above the other in an interconnected structure and conductor tracks arranged on and/or in individual ceramic layers and connected to one another as the conductor structure for the electrical/electronic circuit. The interconnected structure is formed by a firing operation. A first conductor substructure is formed in a first interconnected structure subassembly which comprises at least one of the ceramic layers, and a second conductor substructure is formed in a second interconnected structure subassembly which is directly adjacent to the first interconnected structure subassembly and comprises at least one of the ceramic layers. The second conductor substructure substantially consists of high-current conductor tracks and is configured to contact a power circuit. The first conductor substructure substantially consists of signal conductor tracks and is configured to contact a drive circuit for the power circuit.