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公开(公告)号：US10129987B2
公开(公告)日：2018-11-13
申请号：US15550086
申请日：2015-12-21
Applicant: Robert Bosch GmbH
Inventor： Harun Bueyuekgoez , Roland Gerstner , Josef Weber
Abstract: The invention relates to a circuit carrier (1) comprising a plurality of inorganic substrate layers (1.1) that have partial metallizations (1.2, 1.3, 1.4, 1.5, 1.6) for the purpose of electrical and/or thermal conduction, and to a corresponding method for producing such a circuit carrier (1). According to the invention, at least one partial metallization is made in the form of an insert (1.2) that fills a corresponding shaped hole (1.7) introduced into one of said inorganic substrate layers (1.1).
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公开(公告)号：US20230051374A1
公开(公告)日：2023-02-16
申请号：US17789124
申请日：2021-02-04
Applicant: Robert Bosch GmbH
Inventor： Peter Tauber , Josef Weber , Ralf Winkler
Abstract: A ceramic carrier substrate for an electrical/electronic circuit. The substrate includes ceramic layers arranged one above the other in an interconnected structure and conductor tracks arranged on and/or in individual ceramic layers and connected to one another as the conductor structure for the electrical/electronic circuit. The interconnected structure is formed by a firing operation. A first conductor substructure is formed in a first interconnected structure subassembly which comprises at least one of the ceramic layers, and a second conductor substructure is formed in a second interconnected structure subassembly which is directly adjacent to the first interconnected structure subassembly and comprises at least one of the ceramic layers. The second conductor substructure substantially consists of high-current conductor tracks and is configured to contact a power circuit. The first conductor substructure substantially consists of signal conductor tracks and is configured to contact a drive circuit for the power circuit.
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公开(公告)号：US20180027667A1
公开(公告)日：2018-01-25
申请号：US15550086
申请日：2015-12-21
Applicant: Robert Bosch GmbH
Inventor： Harun Bueyuekgoez , Roland Gerstner , Josef Weber
CPC classification number: H05K3/4629 , H05K1/0204 , H05K1/0206 , H05K1/115 , H05K3/4046 , H05K2201/0376 , H05K2201/10416
Abstract: The invention relates to a circuit carrier (1) comprising a plurality of inorganic substrate layers (1.1) that have partial metallisations (1.2, 1.3, 1.4, 1.5, 1.6) for the purpose of electrical and/or thermal conduction, and to a corresponding method for producing such a circuit carrier (1). According to the invention, at least one partial metallisation is made in the form of an insert (1.2) that fills a corresponding shaped hole (1.7) introduced into one of said inorganic substrate layers (1.1).
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公开(公告)号：US12028974B2
公开(公告)日：2024-07-02
申请号：US17789124
申请日：2021-02-04
Applicant: Robert Bosch GmbH
Inventor： Peter Tauber , Josef Weber , Ralf Winkler
CPC classification number: H05K1/0306 , H05K1/0201 , H05K1/0265 , H05K3/4667 , H05K2201/0195 , H05K2201/0352 , H05K2201/066
Abstract: A ceramic carrier substrate for an electrical/electronic circuit. The substrate includes ceramic layers arranged one above the other in an interconnected structure and conductor tracks arranged on and/or in individual ceramic layers and connected to one another as the conductor structure for the electrical/electronic circuit. The interconnected structure is formed by a firing operation. A first conductor substructure is formed in a first interconnected structure subassembly which comprises at least one of the ceramic layers, and a second conductor substructure is formed in a second interconnected structure subassembly which is directly adjacent to the first interconnected structure subassembly and comprises at least one of the ceramic layers. The second conductor substructure substantially consists of high-current conductor tracks and is configured to contact a power circuit. The first conductor substructure substantially consists of signal conductor tracks and is configured to contact a drive circuit for the power circuit.
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