Invention Grant
- Patent Title: Resilient micro lattice electrical interconnection assembly
-
Application No.: US17397314Application Date: 2021-08-09
-
Publication No.: US12028978B2Publication Date: 2024-07-02
- Inventor: Matthew J. Pirih , Steven J. Mass , Andrew Yurko
- Applicant: Northrop Grumman Systems Corporation
- Applicant Address: US VA Falls Church
- Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
- Current Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
- Current Assignee Address: US VA Falls Church
- Agency: KLINTWORTH & ROZENBLAT IP LLP
- The original application number of the division: US16118892 2018.08.31
- Main IPC: H05K1/14
- IPC: H05K1/14 ; B33Y80/00 ; H05K3/36 ; H05K3/40

Abstract:
An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas on parallel spaced-apart printed circuit boards when the distal ends of the truss structure engage and are compressed between the two areas.
Public/Granted literature
- US20210368622A1 RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY Public/Granted day:2021-11-25
Information query