Invention Grant
- Patent Title: Chip package, method of forming a chip package and method of forming an electrical contact
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Application No.: US17090941Application Date: 2020-11-06
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Publication No.: US12033972B2Publication Date: 2024-07-09
- Inventor: Joachim Mahler , Michael Bauer , Jochen Dangelmaier , Reimund Engl , Johann Gatterbauer , Frank Hille , Michael Huettinger , Werner Kanert , Heinrich Koerner , Brigitte Ruehle , Francisco Javier Santos Rodriguez , Antonio Vellei
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: VIERING, JENTSCHURA & PARTNER MBB
- Priority: DE 2016109349.1 2016.05.20
- The original application number of the division: US15600857 2017.05.22
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/02 ; H01L23/29 ; H01L23/31 ; H01L23/495
Abstract:
A method of forming an electrical contact is provided. The method may include depositing, by atomic layer deposition, a passivation layer over at least a region of a metal surface, wherein the passivation layer may include aluminum oxide, and electrically contacting the region of the metal surface with a metal contact structure, wherein the metal contact structure may include copper.
Public/Granted literature
- US20210082861A1 CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING AN ELECTRICAL CONTACT Public/Granted day:2021-03-18
Information query
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