Invention Grant
- Patent Title: Electronic package and manufacturing method thereof
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Application No.: US17571901Application Date: 2022-01-10
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Publication No.: US12057409B2Publication Date: 2024-08-06
- Inventor: Chih-Hsien Chiu , Wen-Jung Tsai , Chien-Cheng Lin , Ko-Wei Chang , Yu-Wei Yeh , Shun-Yu Chien , Chia-Yang Chen
- Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Applicant Address: TW Taichung
- Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee Address: TW Taichung
- Agency: Kelly & Kelley, PLLC
- Priority: TW 0143376 2021.11.22
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/16 ; H01L23/31 ; H01L23/498 ; H01L23/58
Abstract:
An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.
Public/Granted literature
- US20230163082A1 ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-05-25
Information query
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