Invention Grant
- Patent Title: Systems and methods for substrate support temperature control
-
Application No.: US16844764Application Date: 2020-04-09
-
Publication No.: US12062567B2Publication Date: 2024-08-13
- Inventor: Zubin Huang , Rui Cheng , Diwakar Kedlaya , Satish Radhakrishnan , Anton V. Baryshnikov , Venkatanarayana Shankaramurthy , Karthik Janakiraman , Paul L. Brillhart , Badri N. Ramamurthi
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01J37/32 ; H01L21/67
Abstract:
Exemplary methods of semiconductor processing may include coupling a fluid conduit within a substrate support in a semiconductor processing chamber to a system foreline. The coupling may vacuum chuck a substrate with the substrate support. The methods may include flowing a gas into the fluid conduit. The methods may include maintaining a pressure between the substrate and the substrate support at a pressure higher than the pressure at the system foreline.
Public/Granted literature
- US20210320027A1 SYSTEMS AND METHODS FOR SUBSTRATE SUPPORT TEMPERATURE CONTROL Public/Granted day:2021-10-14
Information query
IPC分类:
