Invention Grant
- Patent Title: Dielectric materials, capacitors and memory arrays
-
Application No.: US17236865Application Date: 2021-04-21
-
Publication No.: US12062688B2Publication Date: 2024-08-13
- Inventor: Richard Beeler , Matthew N. Rocklein , Timothy A. Quick , An-Jen B. Cheng , Sumeet C. Pandey
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L49/02

Abstract:
Some embodiments include dielectric material having a first region containing HfO and having a second region containing ZrO, where the chemical formulas indicate primary constituents rather than specific stoichiometries. The first region contains substantially no Zr, and the second region contains substantially no Hf. Some embodiments include capacitors having a first electrode, a second electrode, and a dielectric material between the first and second electrodes. The dielectric material includes one or more first regions and one or more second regions. The first region(s) contain(s) Hf and substantially no Zr. The second region(s) contain(s) Zr and substantially no Hf. Some embodiments include memory arrays.
Public/Granted literature
- US20220344451A1 Dielectric Materials, Capacitors and Memory Arrays Public/Granted day:2022-10-27
Information query