Invention Grant
- Patent Title: Laser processing apparatus and method for processing workpiece
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Application No.: US17307252Application Date: 2021-05-04
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Publication No.: US12076815B2Publication Date: 2024-09-03
- Inventor: Masashi Shimbori , Osamu Wakabayashi
- Applicant: Gigaphoton Inc.
- Applicant Address: JP Tochigi
- Assignee: Gigaphoton Inc.
- Current Assignee: Gigaphoton Inc.
- Current Assignee Address: JP Tochigi
- Agency: Studebaker & Brackett PC
- Main IPC: B23K26/073
- IPC: B23K26/073 ; B23K26/06 ; B23K26/0622 ; B23K26/066 ; B23K26/082

Abstract:
A laser processing apparatus includes a placement base on which a workpiece is placed, a beam shaping optical system that shapes laser light such that a first laser light irradiated region of a mask blocking part of the laser light has a rectangular shape having short edges and long edges, the beam shaping optical system capable of causing one of a first radiation width of the first irradiated region in the direction parallel to the short edges and a second radiation width of the first irradiated region in the direction parallel to the long edges to be fixed and causing the other to be changed, a projection optical system that projects a pattern on the mask onto the workpiece, and a mover that moves the first irradiated region at least in the direction parallel to the short edges to move a second laser light irradiated region of the workpiece.
Public/Granted literature
- US20210252634A1 LASER PROCESSING APPARATUS AND METHOD FOR PROCESSING WORKPIECE Public/Granted day:2021-08-19
Information query
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