Invention Grant
- Patent Title: Transistor structure
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Application No.: US18335154Application Date: 2023-06-15
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Publication No.: US12087635B2Publication Date: 2024-09-10
- Inventor: Shih-Yin Hsiao , Ching-Chung Yang , Kuan-Liang Liu
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW 6135221 2017.10.13
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L21/8234 ; H01L21/8249 ; H01L29/06 ; H01L29/423 ; H01L29/49 ; H01L29/78

Abstract:
A transistor structure includes a source region and a drain region disposed in a substrate, extending along a first direction. A polysilicon layer is disposed over the substrate, extending along a second direction perpendicular to the first direction, wherein the polysilicon layer includes a first edge region, a channel region and a second edge region formed as a gate region between the source region and the drain region. The polysilicon layer has at least a first opening pattern at the first edge region having a first portion overlapping the gate region; and at least a second opening pattern at the second edge region having a second portion overlapping the gate region.
Public/Granted literature
- US20230326801A1 TRANSISTOR STRUCTURE Public/Granted day:2023-10-12
Information query
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