Invention Grant
- Patent Title: Power module having an elevated power plane with an integrated signal board and process of implementing the same
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Application No.: US18156484Application Date: 2023-01-19
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Publication No.: US12087680B2Publication Date: 2024-09-10
- Inventor: Zach Cole , Steven Ericksen
- Applicant: WOLFSPEED, INC.
- Applicant Address: US NC Durham
- Assignee: Wolfspeed, Inc.
- Current Assignee: Wolfspeed, Inc.
- Current Assignee Address: US NC Durham
- Agency: BakerHostetler
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01L23/498 ; H01L25/07 ; H05K1/14 ; H05K1/18
Abstract:
A power module includes at least one electrically conductive power substrate; and a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate. The power module further includes at least one elevated signal element electrically connected to the plurality of power devices and/or at least one elevated power plane electrically connected to the at least one electrically conductive power substrate and electrically connected to the plurality of power devices.
Public/Granted literature
Information query
